Headphone
Modeling and Rendering of a Headphone (Beat Solo 3)
Structural analysis of the headband of a headphone.
The aim of this project was to make a detailed assembly model of a headphone (Beats Solo 3 wireless for reference).
Followed by structural analysis of the headband using basic boundary conditions to study stress, deformation and fatigue for 100,000 cycles.
The basic exterior body of the headphone is plastic (mostly polycarbonate or polyeurathene).
Internally headband has a thin cold rolled metal strip.
The head-over and earpiece cushions are generally foam covered with artificial leather material.
Other electronic parts are copper or other metal.
ANSYS Workbench - Static Structural was used to carry out the analysis. The midsection of the headband was fixed and a displacement load of 30mm on each side was applied. Solution was obtained for total displacement and Von-Mises stress.
Fatigue tool using stress - life (S-N) approach solved the problem for 100,000 cycles. The number of cycles was considered by assuming the life of the product for 3 years on an average and usage everyday.
Considering the mean stress effect, the loading situation of the headband was “zero to maximum”. The stress ratio (R) was 0 and amplitude ratio (A) was 1. In direct
correspondence with the practical fatigue properties, the ultimate strength approach called the Goodman curve was applied.
The deformation results and von-mises stress results were found to be safe.